Producing Ability
생산 능력
STANDARD
SHEET SIZE
400mm * 500mm
MATERIAL
Copper Alloy,
Ni Alloy, SUS
Copper Alloy
구리 합금
(CAPA 기준: 일일)
| Mat'l/Q'TY/T/Process | 0.102 | 0.254 | 0.500 | 1.000 | |
|---|---|---|---|---|---|
| COATING & EXPOSING | SHEET | 4,200 | 4,200 | 4,200 | 4,200 |
| 반도체부품 (Kpcs) | 210 | 210 | 210 | 210 | |
| 정밀부품 (Kpcs) | 560 | 560 | 560 | 560 | |
| ETCHING | SHEET | 6,400 | 4,700 | 2,900 | 1,600 |
| QFP (Kpcs) | 320 | 235 | 145 | 80 | |
| SMD (Kpcs) | 850 | 627 | 387 | 213 | |
Ni ALLOY
니켈 합금
(CAPA 기준: 일일)
| Mat'l/Q'TY/T/Process | 0.102 | 0.254 | 0.500 | 1.000 | |
|---|---|---|---|---|---|
| COATING & EXPOSING | SHEET | 3,800 | 3,800 | 3,800 | 3,800 |
| 반도체부품 (Kpcs) | 180 | 180 | 180 | 180 | |
| 정밀부품 (Kpcs) | 500 | 500 | 500 | 500 | |
| ETCHING | SHEET | 4,900 | 2,800 | 1,800 | 1,200 |
| QFP (Kpcs) | 245 | 140 | 90 | 60 | |
| SMD (Kpcs) | 653 | 373 | 240 | 160 | |
SUS
스테인리스강
(CAPA 기준: 일일)
| Mat'l/Q'TY/T/Process | 0.102 | 0.254 | 0.500 | 1.000 | |
|---|---|---|---|---|---|
| COATING & EXPOSING | SHEET | 3,400 | 3,400 | 3,400 | 3,400 |
| 반도체부품 (Kpcs) | N/A | N/A | N/A | N/A | |
| 정밀부품 (Kpcs) | N/A | N/A | N/A | N/A | |
| ETCHING | SHEET | 3,300 | 2,500 | 1,500 | 900 |
| QFP (Kpcs) | N/A | N/A | N/A | N/A | |
| SMD (Kpcs) | N/A | N/A | N/A | N/A | |
